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| Backside Equipment DynaTex GST 150
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Backside Equipment > DynaTex GST 150
Manufacturer:DynaTex
Condition:Used,we sell it at AS IS.
Price:Best Offer
PRODUCT BENEFITS
? More real estate and narrower street widths,
because Zero kerf loss allows higher die
density on the wafer
? Increased production rates
? Chip free results
? Less residual stress
? No toxic water discharge
? No D.I. water costs
PRODUCT FEATURES
Automatic
? Capable of completely and automatically
scribing and breaking many substrate
materials.
Cost effective
? Reduced production time
? System integration allows easy hook-up and
transport
? Superior yields and improved efficiency
Environmental
? No D.I. or toxic wastewater
Versatile
? Fully programmable for all scribing and
breaking parameters, including TrueAngle?
diamond tool positioning
? Infinitely programmable with Pentium?
powered Windows? interface
Easy
? Stored Process eliminates operator
adjustments when changing between wafer
types
GST-150 SPECIFICATIONS
Wafer Size: 150mm max. (6" max.)
Wafer Thickness: 40 um to 1725 um (material
dependant)
Minimum Die Size: 200 um square (dependent
on type of material and wafer thickness)
Minimum Wafer Index: 5 um with Std.
Encoders; 2 um with Optional Hi-Res.
Encoders
Maximum Wafer Index: 150 mm
Maximum Backside Metal: 10 um (dependent
on type of material and process)
Scribe Channel Width: < 5 um
Load Time: < 15 seconds
Alignment Time: < 30 seconds
Scribe Speed: 2 mm/sec to 100mm/sec
(0.080"/sec to 4 "/sec) (dependent on type of
material and process)
Break Rate: 2 breaks/sec. (depending on
substrate thickness and backside metals)
Break Method: Patented impulse bar
Vision System: Digital Hi-Res BW/Color
Camera; 17" Color Monitor; Pattern
Recognition System for Auto Alignment, Edge
Detection for automatic bar and piece
alignment, and Auto Step-Correction
Programmable: Scribe Tool Life; Scribe Angle;
Scribe Approach Speed; Scribe Force; Scribe
Speed; Scribe Extension; Break Force; Multiple
Die Size; Fiducial Image Storage; Wafer Type
and Profile; Multiple Wafer Profile Storage.
(Profile programmable in metric or imperial
units)
Wafer Mounting:Std: Metal Saw Frames (FF-
105 and FF-108); Optional: 7" or 6" Hoop Sets
(limits max. wafer size to 4" and 3")
Substrates: Saphire, GaAs, LiNbO3, Glass, InP,
GaP, Silicon, Quartz |
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| Related Products |
|  Nel System Wafer Mounter for Dicing Process MA1508N
Global Nanotech Equipment Co.
Nel System Wafer Mounter for Dicing Process MA1508N
Backside Equipment > Nel System Wafer Mounter for Dicing Process MA1508N
Manufacturer:Nel
Condition:Used,we ... |
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